Colloidal Silica Suspension 30 nm and nano- and micro-fabrication directly

and nano- and micro-fabrication directly on the substrates

The Unmounted Chip Carrier Toolkit is included in all Innova systems

15 or 20mm diameter

Hexagonal (honeycomb) Mesh

13268 Dressing Forceps

Colloidal Silica Suspension 30 nm and nano- and micro-fabrication directlyDESCRIPTION A non crystallizing silica (SiO2) suspension stabilized at an alkaline pH value of 9. 8. The combination of very fine abrasive particles in a chemically aggressive liquid provides a Chemical Mechanical Polishing (CMP) action. Ideal for final polishing to obtain a deformation free surface. Obtain excellent results on IC cross sections, ceramics, minerals, hard steels and ductile non ferrous materials. Recommended as final polishing for EBSD